AIM Solder
AIM Solder 21075-18-01 NC258 Solder Paste, No Clean, Sn63Pb37, T4, 250g Jar
Our Part #592-848
Condition:New
Mfr Part #21075-18-01
AIM Solder
AIM Solder 21075-18-01 NC258 Solder Paste, No Clean, Sn63Pb37, T4, 250g Jar
Our Part #592-848
Condition:New
Mfr Part #21075-18-01
Next Day Air Only
WARNING
$150.00EACH
Multiples of: 30
Next Day Air Only
Calif. Prop 65
- Description
- Specifications
- Documents
- Long Pause-to-Print Capabilities
- Excellent Wetting, Even Leadless Devices
- Reduces Voiding
- Low Post Process Residues
- RoHS Compliant
- Passes Bono Testing
NC258 has been developed to offer long pause-to-print capabilities while enhancing fine print definitions. NC258 reduces voiding. The superior wetting ability of NC258 results in bright, smooth and shiny solder joints. It also offers very low post process residues, which remain crystal clear even at the elevated temperatures required for today’s lead-free alloys.
Brand: AIM Solder
Alloy Name: Sn63/Pb37
Flux Type: No Clean
Lead Free: No
Powder Mesh Size: T4
Package Type: Jar
Alloy Type: Eutectic Alloys
Composition: 63/37 (63% Tin, 37% Lead)
Container Type: 250g Jar
Melting Point: 183 C (361 F)
Standards: RoHS Compliant
Type: Solder Paste
Viscosity: 600-900 Depending on metal load and particle size
$150.00EACH
Multiples of: 30