• High thermal stability
• Improves soldering performance
• Eliminates the need and expense of cleaning
• Classified as ROL0 under IPC J-STD-004 and ROL1 under IPC J-STD-004B

Kester 186-18 Soldering Flux (5 Gallons), under MIL-F-14256, was QPL approved as Type RMA. Although the fluxing ability approaches that of Type RA flux, the flux residue after soldering is non-corrosive and non-conductive. 186-18 rosin flux has been developed for use in critical applications where difficult assemblies are to be soldered, but process requirements stipulate the use of Type RMA flux. This flux possesses high thermal stability for soldering multi-layer assemblies that require a high preheat temperature. Exposure to high preheat temperatures does not degrade the solubility of the residue in normal cleaning solvents. There is no surface insulation resistance degradation caused by the flux residue. The use of a minimum of ionic activating agents and the inactive nature of the residue permits leaving the residue on circuit board assemblies for many applications. The flux residue is also moisture and fungus-resistant.