Global Specialties GS-630T Solderless Breadboard

Features and Specifications

• 630 Tie-Points
• Maximum capacity of 1.5 A at 36 V
• Transparent ABS plastic body
• Nickel plated phosphor bronze spring clip contacts
• Allowable wire diameter of 0.4-0.7 mm
• Fits 7 total 16-pin ICs
• Measures 6.5 x 1.375 x 0.33 in
• Peel and stick adhesive

A modular type solderless breadboard, the GS-630T connects with the GS-100T bus strip to make a 830 tie point breadboard (GS830T). Expandable, it is a great way to prototype low frequency or DC powered circuits.