The EXB-SN96.5AG3.0CU0.5-0.5LB is an Extruded High Purity Solder Bar Sn96.5/Ag3.0/Cu0.5 1/2 lb (227g)

• Extruded High Reliability Solder Bar
• Manufactured Specifically for High Quality Electronics Manufacturing (EMS, ECM, OEMs)
• Designed for Solder Pots, Wave Solder Machines and Selective Solder Machines
• Chip Quik Super Low Dross Solder Bar is Ideal for Through Hole and Surface Mount Soldering
• High Purity

• Alloy: Sn96.5/Ag3.0/Cu0.5
• Melting Point: 217-220C (423-428F)
• Size: 0.5 lb (227 +/-10 g) bar (Ships bagged. To ensure weight tolerance is met: Full bar and/or fractional bar segments may be combined in each bag.)
• Purity: Conforms to all IPC J-STD-006C soldering alloy impurity levels