Multicore X33-12i is a no clean, resin free, halide free liquid flux for surfaces with poor solderability.

Features and Benefits:

• Maximum process window and sustained activity – without resin
• High speed soldering on conventional leaded and SMD components – no bridges or icicles
• Good through hole penetration
• No cleaning – reduces costs
• Minimal residues to interfere with ATE probes without cleaning
• Compatible with rosin and OSP based surface preservatives
• Foam, spray or wave application

Applications:

Recommended for consumer electronics and general electrical soldering applications, particularly where high throughput is desirable.