• Lowest voiding water-soluble flux for solder paste.
• Reduced largest voids.
• Fewer voids.
• Minimized voiding overall.
• Exceptional printing process window.
• Excellent response-to-pause.
• Long stencil life.
• Prints consistently at a wide range of speeds.
• Wide reflow process window for profiling.
• Excellent wetting on a variety of surface finishes.
• Maintains tack over time.

The Indium PASTEOT-804120-500G-T4 is a versatile, water-soluble solder paste flux, formulated for air or nitrogen reflow. It is capable of SAC assembly processes with a wide reflow process window. This solder paste provides exceptional stencil printing performance, with long stencil life and excellent response-to-pause. Indium 6.5R exhibits superior wetting to a variety of surface finishes and exhibits excellent low-voiding performance.