Loctite 945398 Epoxy Encapsulant

ECCOBOND FP4545FC epoxy encapsulant designed as underfill and helps dissipate stress on solder joints and extends thermal cycling performance. This material is specially suited for flip-chip devices requiring improve crack/fracture resistance and noclean flux compatibility.

Features:

• Color: Black
• Odor: Odorless
• Specific Gravity: 1.6
• Flash Point: >212°F
• VOC Content: 0.02%