• Electrically conductive
• Thermally conductive
• One component
• Ease of use
• Void-free bondline
• Hydrophobic
• Stable at high temperatures
• High resistance to delamination
• Good resistance to "popcorning" after exposure to reflow temperatures

LOCTITE ABLESTIK QMI519 silver filled conductive adhesive is recommended for use in bonding integrated circuits and components to metal leadframes. It is designed to achieve UPHs several orders of magnitude higher than conventional oven cured adhesives. Maximum productivity is realized through in-line cure, either on the diebonder using a post diebond heater or on the wirebonder preheater. Studies have also shown improved coplanarity in parts cured on the diebonder. This product and its use may be covered by patent 5,717,034 and by one or more pending patent applications.