• One component
• Fast cure at moderate temperatures
• High Tg
• Halogen free
• Compatible with most Pb-free solders
• Stable electrical performance in temperature humidity bias
• Reworkable
• Room temperature flow capability

LOCTITE ECCOBOND UF 3810 reworkable epoxy underfill is designed for CSP and BGA applications. It cures quickly at moderate temperatures to minimize stress to other components. When cured, this material provides excellent mechanical properties to protect solder joints during thermal cycling.