• Controlled flux spread as a result of precise dispensing
• Holds small parts in place before soldering
• Delivers more flux compared to flux-core wire solder
• Formulas for wetting to difficult-to-solder surfaces (stainless steel, etc.)
• Convenient sizes: 10cc, 30cc, 55cc, and 70cc syringes; 6 oz cartridges; and 2 oz and 6 oz jars
• Compatible with range of dispensing solutions, including jetting systems

Formulated to work with any alloy and heating process, Nordson EFD’s FluxPlus™ is perfect for BGA rework, mobile device repair, reflowing solder paste, and more.

Unlike liquid fluxes, tacky FluxPlus can be applied exactly where needed without contaminating nearby areas. EFD provides a wide array of formulations for use in a variety of applications.