• RMA paste for SnPb and Pb-free alloys
• Halogen-free per EN14582 test method
• High-performance stencil printing characteristics
• Eliminates hot and cold slump
• Robust reflow performance to accommodate assembly of BGA and components with large ground planes
• High oxidation resistance
• Clear, probe-testable post-reflow residues
• Maintains very high resistance during SIR testing
• Ideal for mixed alloy SnPb and Pb-free processes
• Available with SACm® for high-reliability Pb-free performance with low Ag content

Solder Paste

Indium Corporation’s high quality solder pastes are uniquely formulated for superior performance to satisfy a variety of assembly requirements.

Indium Corporation produces a wide range of solder paste products to fit every need and challenge in the PCB Assembly and semiconductor manufacturing market space. Solder paste can be manufactured in hundreds of alloys and with powder size ranging from Type 3 to Type 8. Solder pastes are available for a wide variety of process deposition techniques, including printing, dipping, dispensing, jetting, and pin transfer assembly. Each formula is specifically designed to meet the gamut of manufacturing challenges that plague the electronics manufacturing industry. Whether you are dealing with warpage induced defects, voiding, insufficient solder paste volume, or electrical or mechanical reliability issues, Indium Corporation’s solder pastes allow for the lowest total cost of ownership and fewer end-of-line defects.

RMA-155 Solder Paste

RMA-155 is an air reflow, RMA solder paste formulated to accommodate a variety of alloys for electronics assembly. RMA-155 has balanced performance to accommodate the widest variety of processes including: consistent stencil printing transfer, robust reflow window, and residue compatible with in-circuit testing.

Refrigerated storage will prolong the shelf life of solder paste. The shelf life of RMA-155 is 6 months when stored at <10°C. Solder paste packaged in cartridges should be stored tip down. Solder paste should be allowed to reach ambient working temperature prior to use. Generally, paste should be removed from refrigeration at least 2 hours before use. Actual time to reach thermal equilibrium will vary with container size. Paste temperature should be verified before use. Jars and cartridges should be labeled with date and time of opening.

Compatible Products
• Rework Flux: TACFlux® 020B, TACFlux® 089HF
• Cored Wire: CW-807
• Wave Flux: WF-7745, WF-9945