Techni-Tool
Indium Solder
Indium Solder

Indium Solder PASTEOT-801218-500g-T3 Solder Paste, Water Soluble, Leaded, T3, 89.8%, Sn63Pb37, 500g Jar

Our Part #10221408

Condition:New

Mfr Part #PASTEOT-801218-500g-T3

Indium Solder PASTEOT-801218-500g-T3
Indium Solder
Indium Solder

Indium Solder PASTEOT-801218-500g-T3 Solder Paste, Water Soluble, Leaded, T3, 89.8%, Sn63Pb37, 500g Jar

Our Part #10221408

Condition:New

Mfr Part #PASTEOT-801218-500g-T3

Next Day Air Only
CA Prop 65
$98.31EACH
Quantity on Order:20
Next Day Air Only
Calif. Prop 65
  • Lowest voiding water-soluble flux for solder paste: Reduced largest voids, Fewer voids, Minimized voiding overall, For BGA, CSP, and bottom termination components, such as QFNs
  • Exceptional printing process window: Excellent response-to-pause, Long stencil life (>8 hours in controlled environment), Prints consistently at a wide range of speeds
  • Wide reflow process window for profiling
  • Excellent wetting on a variety of surface finishes
  • Maintains tack over time
  • Suitable for SnPb eutectic alloys as well as Pb-free alloys

Solder Paste

Indium Corporation’s high quality solder pastes are uniquely formulated for superior performance to satisfy a variety of assembly requirements.

Indium Corporation produces a wide range of solder paste products to fit every need and challenge in the PCB Assembly and semiconductor manufacturing market space. Solder paste can be manufactured in hundreds of alloys and with powder size ranging from Type 3 to Type 8. Solder pastes are available for a wide variety of process deposition techniques, including printing, dipping, dispensing, jetting, and pin transfer assembly. Each formula is specifically designed to meet the gamut of manufacturing challenges that plague the electronics manufacturing industry. Whether you are dealing with warpage induced defects, voiding, insufficient solder paste volume, or electrical or mechanical reliability issues, Indium Corporation’s solder pastes allow for the lowest total cost of ownership and fewer end-of-line defects.

Pb-Free Water-Soluble Solder Pastes
Over the last decade, the electronics industry has shifted to no-clean fluxes for surface mount assembly. Despite this industry trend, Indium Corporation has not only maintained a variety of water-soluble solder pastes and fluxes, but has revolutionized the category with the release of several new and versatile solder pastes. These solder pastes allow current water-wash manufacturing processes to not only survive, but to thrive.

Indium6.4R Water-Soluble Pb-Free and SnPb Solder Paste

Indium6.4R is a versatile, water-soluble solder paste flux, formulated for air or nitrogen reflow. It is capable of SnPb and Pb-free assembly processes with an exceptional reflow process window. This solder paste provides exceptional stencil printing performance, with long stencil life and excellent response-to-pause. Indium6.4R exhibits superior wetting to a variety of surface finishes and exhibits the best voiding performance, with fewest voids, reduced size of largest voids, and overall minimized voiding for BGAs, CSPs, and BTCs (QFNs, DPAKs, LGAs, etc.).


BrandIndium Solder
AlloySn63Pb37
Alternate Product Number801218
Flux TypeORH1
Series6.4R Series
TypeSolder Paste
Lead FreeNo
Package TypeJar
Lead TypeLeaded
Physical StatePaste
Volume500 g
Powder Mesh SizeT3
Metal %89.8 %
Composition63/37 (63% Tin, 37% Lead)
Flux CharacteristicsWater Soluble
Package500g Jar
Shelf Life6 months
Water SolubleYes
$98.31EACH
Quantity on Order:20