• Low cost of ownership—no Ag
• Creates shiny, aesthetically pleasing solder joints
• Low dross creation rate
• Low copper erosion

Indalloy®291 is a direct replacement to the previously patent-protected Sn100C® alloy. Indalloy®291 is commonly used in wave soldering and reworking processes as a no-silver, lead-free alternative to SAC305. Indalloy®291 is available in bar, solder paste, and solid and cored wire.

Indalloy®291 bar and wire will comply with the requirements of ASTM B-32, J-STD-006 (formerly QQS-571F) and JIS-Z-3282. Each batch of solder alloy used to manufacture Indium Corporation’s bar solder, bar solder chips, and cored wire is analyzed for metallic composition and impurities. Indium Corporation will certify its bar solder and cored wire to meet customer specifications with a Certificate of Compliance or provide a Certificate of Analysis upon request.

• Lower overall cost resulting from the lower silver content compared to other Pb-free alloy families − No silver or bismuth
• Eutectic alloy that acts like a SnPb alloy
• Indalloy®291 has a slower copper dissolution rate as compared to SAC305; Indalloy®291 erodes copper from holes and pads on the PCB more slowly than SAC solders
• Shiny, aesthetically pleasing solder joints
• Reduced bridging and icicles
• Works well in selective and dip soldering processes