• Compatible with lead-free alloys such as SnAg, SnCu, SnAgCu, SnAgBi
• Reflowable with peak temperatures up to 270°C
• Reflowable in air and nitrogen
• Low voiding
• Bright shiny soldered joints with clear residues
• Aggressive flux on various substrates such as OSP-Cu, immersion finishes and ENIG
• Clear non-tacky residues
• Classified as ROL0 per J-STD-004A
• High tack to minimize skewing of components
• Stencil life of 8+ hours (process dependent)
• Compliant to Bellcore GR-78

Kester TSF-6592HF is a no-clean paste flux designed as a lead-free solution for an array of lead-free interconnect applications such as flip chip attach, sphere or ball attach, rework/repair of CSPs, BGAs, SMDs, or any lead-free soldering application that requires a very tacky flux. It has been optimized for consistent high speed printing applications.