• More effective at higher operating temperatures than CU21-3240
  
• Higher Tg is the key differentiator with Low CTE
  
• Contains Anhydrides
  
• NON-REWORKABLE

ALPHA HiTech CU11-3127 is a one-component capillary underfill designed for the protection of assembled chip packages onto printed circuit boards. The high Tg, low CTE properties of ALPHA HiTech CU11-3127 protects the solder joints from mechanical stresses such as drop shock and impact bending. ALPHA HiTech CU11-3127, a product with high filler content, is available to provide better mechanical strength for CSP and Flip Chip packages. With a unique low viscosity property, no preheat is required for this product.
This is a one-component capillary underfill designed for the protection of assembled chip packages onto printed circuit boards. The high Tg, low CTE properties of ALPHA HiTech CU11-3127 protects the solder joints from mechanical stresses such as drop shock and impact bending. ALPHA HiTech CU11-3127, a product with high filler content, is available to provide better mechanical strength for CSP and Flip Chip packages. With a unique low viscosity property, no preheat is required for this product.