Kester NP510-LT HRL1 | Low Temperature Solder Paste
Enabling technology providing similar drop shock and thermal cycle performance to SAC305 for many applications while reflowing under 200 °C.
Kester NP510-LT HRL1 Solder Paste
Eliminates thermally induced defects such as BGA, Head-in-Pillow, and Non-Wet Opens.
Reflow under 200 °C
For specific applications, NP510-LT with HRL1 alloy can provide similar drop shock and thermal cycling performance to that of SAC305 all at reflow temperatures under 200 °C.
Elimination of Thermally Induced Defects
By reflowing under 200 °C, less thermal stress is applied to the PCB and components, minimizing PCB and component warpage which eliminates defects related to higher temperatures.
Superior Printing Performance
NP510-LT HRL1 has excellent print characteristics at area ratios of 0.60 and above, especially on fine feature devices. Long stencil life lasting up to 8 hours.
Outstanding Void Performance
NP510-LT HRL1 provides outstanding void performance, typically providing 50% of what you normally see with SAC-based solder pastes.