• Classified ROL0 per IPC J-STD-004B
• Zero Halogen (none intentionally added)
• Lower reflow peak temperature (180° to 190° C) compared to traditional lead-free alloys
• Reduction in board-to-package warpage
• Wide reflow profile window with good solderability on various PCB surface finish
• Excellent printability above 0.60 area ratio
• Colorless residues for easy post-flow inspection
• Low voiding in various packages - BGA, MLG, DPAK, LGA

Kester NP510-LT HRL1 is a no-clean, lead-free, zero-halogen solder paste for assemblies that have temperature sensitive substrates and components. The need for deduction of warpage induced defects is becoming more evident as complexity of product designs become more complex and packages become thinner. NP510-LT HRL1 addresses these technology needs by enabling lower temperature reflow and enhancing mechanical reliability. All components used with NP510-LT HRL1 must be lead-free to eliminate the formation of tin/lead/bismuth intermetallic which has a melting point under 100° C.