• Conveniently-packaged epoxy system with an extended pot life for high strength conductive bonds
• Fully cured material offers high strength bonds
• Extended pot life provides sixty minute work time
• Repairs defective traces and creates jumpers on boards
• Quick solderless electronic connections

The conveniently-packaged epoxy system with an extended pot life for high strength conductive bonds.

Used for electronics applications including: Conductive Bonds Between Heat Sensitive Components, Solderless Surface Mount Connections, Circuit Board Trace Repair, Static Discharge and Grounding, Solder Repair, Conductive Structural Adhesions