• Bonds strongly to metal, glass and many plastics
• Cures with LED exposure (365 – 405nm)
• Can cure up to 5mm thick, ideal for encapsulation
• Secondary moisture cure
• Low viscosity, easily wets out horizontal surfaces

The MG Chemicals UVLED82-1L adhesive is specially formulated to cure using both broadband and LED light sources such as 365, 385, 395 and 405nm. This product is ideal for edge bonding chips and other circuit components when high throughput is needed. The low viscosity coupled with depth of cure enables encapsulation of parts up to a thickness of 5mm (1/5”). The adhesive contains a secondary cure mechanism that allows for curing in shadowed areas.