Techni-Tool
Indium Solder
Indium Solder

Indium Solder PASTEOT-800164-500g-T3 Solder Paste, Water Soluble, Lead Free, T3, 88.5%, SAC305, 500g Jar

Our Part #881SO321

Condition:New

Mfr Part #PASTEOT-800164-500g-T3

Indium Solder PASTEOT-800164-500g-T3
Indium Solder
Indium Solder

Indium Solder PASTEOT-800164-500g-T3 Solder Paste, Water Soluble, Lead Free, T3, 88.5%, SAC305, 500g Jar

Our Part #881SO321

Condition:New

Mfr Part #PASTEOT-800164-500g-T3

Next Day Air Only
CA Prop 65
$135.95EACH
Quantity on Order:50
Qty:Price:Savings
1$135.95
5$123.03Save 10%
10$116.24Save 14%
50$108.76Save 20%
Next Day Air Only
Calif. Prop 65
  • Consistent fine-pitch printing performance with high transfer efficiency from stencil apertures
  • Superior fine-pitch soldering ability
  • Wide reflow profile window
  • Excellent response-to-pause printing performance
  • Outstanding slump resistance
  • Low-voiding
  • Minimal foaming during the cleaning process
  • Excellent wetting

Solder Paste

Indium Corporation’s high quality solder pastes are uniquely formulated for superior performance to satisfy a variety of assembly requirements.

Indium Corporation produces a wide range of solder paste products to fit every need and challenge in the PCB Assembly and semiconductor manufacturing market space. Solder paste can be manufactured in hundreds of alloys and with powder size ranging from Type 3 to Type 8. Solder pastes are available for a wide variety of process deposition techniques, including printing, dipping, dispensing, jetting, and pin transfer assembly. Each formula is specifically designed to meet the gamut of manufacturing challenges that plague the electronics manufacturing industry. Whether you are dealing with warpage induced defects, voiding, insufficient solder paste volume, or electrical or mechanical reliability issues, Indium Corporation’s solder pastes allow for the lowest total cost of ownership and fewer end-of-line defects.

Pb-Free Water-Soluble Solder Pastes
Over the last decade, the electronics industry has shifted to no-clean fluxes for surface mount assembly. Despite this industry trend, Indium Corporation has not only maintained a variety of water-soluble solder pastes and fluxes, but has revolutionized the category with the release of several new and versatile solder pastes. These solder pastes allow current water-wash manufacturing processes to not only survive, but to thrive.

Indium3.2 Pb-Free Water-Soluble Solder Paste

Indium3.2 is an air or nitrogen reflow, water-soluble solder paste specifically formulated to accommodate the higher processing temperatures required by the SnAgCu, SnAg, SnSb, and other Pb-free alloy systems. This product formulation offers consistent, repeatable printing performance combined with a long stencil life and sufficient tack strength to handle the challenges of today’s high-speed as well as high-mix surface mount lines. In addition to consistent printing and reflow requirements, this solder paste offers superb wetting to the various Pb-free metallizations and has exceptional low-voiding performance on fine pitch components, including BGAs and CSPs.


BrandIndium Solder
AlloySAC305
Alternate Product NumberPASTEOT-800164
Flux TypeORM1
Series3.2 Series
TypeSolder Paste
Lead FreeYes
Package TypeJar
Lead TypeLead Free
Physical StatePaste
Volume500 g
Powder Mesh SizeT3
Metal %88.5 %
Composition96.5% Tin, 3% Silver, 0.5% Copper
Package500g Jar
Shelf Life4 Months
Water SolubleYes
$135.95EACH
Quantity on Order:50
Qty:Price:Savings
1$135.95
5$123.03Save 10%
10$116.24Save 14%
50$108.76Save 20%