ALPHA HiTech
ALPHA HiTech 249742.0011GM Capillary Underfill, CU13-3150, Thermal Cure, EFD, 11 gram, 10cc
Our Part #10020427
Condition:New
Mfr Part #249742.0011GM
ALPHA HiTech
ALPHA HiTech 249742.0011GM Capillary Underfill, CU13-3150, Thermal Cure, EFD, 11 gram, 10cc
Our Part #10020427
Condition:New
Mfr Part #249742.0011GM
Next Day Air Only
CA Prop 65
Next Day Air Only
Calif. Prop 65
- Description
- Specifications
- Documents
- Low temperature thermal cure underfill
- Low Viscosity due to no filler
- Fast Cure at Low Temperatures
- Excellent adhesion and Drop Shock performance
- Anhydride Free
- NON-REWORKABLE
ALPHA HiTech CU13-3150 is a one-component, low temperature thermal cure capillary underfill designed for lower temperature applications for thermally sensitive parts. ALPHA HiTech CU13-3150 does not contain any fillers. Its low viscosity property is excellent for BGA application, thus no preheat is required during the dispensing process.
Brand: ALPHA HiTech
Alternate Product Number: CU13-3150
Series: CU13-3050 Series