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Indium Soldering Solutions for State-of-the-Art Processes
Modern soldering techniques are often state-of-the-art, requiring the highest quality materials to ensure consistent, reliable, and void-free solder joints. A myriad of factors must be considered when selecting materials for your process, such as operating temperature, temperature constraints, substrate metallization, and solder form compatibility. If you've got questions, our process experts are here to help — simply complete the RFQ form and we'll be in touch.
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Indium Solder Paste
- No-clean solder paste is most commonly used in modern electronic manufacturing, while water-soluble and RMA solder pastes have specific applications.
- Available in hundreds of alloys and powder sizes from Type 3 to Type 8.
- Suitable for printing, dipping, dispensing, jetting, and pin transfer assembly.
- Engineered to address warpage-induced defects, voiding, insufficient solder paste volume, and reliability issues.
- Products backed by world-renowned technical assistance.
- Ensures the lowest total cost of ownership and fewer end-of-line defects.
Indium Cored Solder Wire
- Solid Core Wire: Available in diameters from 0.010”/0.254mm to 0.062”/1.52mm; some alloys available in diameters less than 0.010”/0.254mm.
- Flux-Cored Wire: Contains flux at the center, used for manual soldering, rework, and robotic soldering applications.
- Facilitates processes by eliminating the need for a separate flux application.
- Available in no-clean, water-soluble, and halogen-free varieties.
- Used in processes and applications extending beyond electronics alone.
Indium Flux
- Product range includes wave flux and semiconductor fluxes such as flip-chip flux.
- Formulated for superior performance across various applications.
- Leader in no-clean semiconductor flux; Indium was first to market a true no-clean flip-chip flux.
- Widely adopted by major OSATs.
- Supports development of smaller, thinner, and more powerful packaging solutions.