Techni-Tool
Kester Alpha Hitech Adhesives



Improving long-term reliability | ALPHA HiTech Solutions from Kester

Using ALPHA HiTech epoxy products ensures your work can survive drop shocks, impact bends, extreme thermal cycles, and helps solve unique assembly challenges.


Download: Alpha HiTech Bonding Materials Brochure



Adhesive
Designed for a Wide Range of Applications

ALPHA HiTech SMD Adhesive is a fast heat curable surface mount adhesive, formulated for use on high-speed dispensers and screen printing applications. These products are designed for holding surface mount components during the wave soldering process.



ALPHA HiTech SM42-1311

  • Specially designed for dispensing
  • Excellent thermal resistant adhesion to FR4, flexible polyimide and chip components.

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ALPHA HiTech SM42-120P

  • Low viscosity, fast flow at room temperature
  • Low curing temperature at 80 °C for 30 minutes

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Kester

ALPHA HiTech Low Temperature Adhesive is designed for bonding temperature sensitive devices to a variety of plastic and metal surfaces, where the materials cannot withstand high curing temperatures. The camera module market is one example of where these adhesives are very applicable.


ALPHA HiTech AD13-9620B

  • Excellent adhesion & drop shock on Heat Sensitive Substrates, as low as 80 to 85°C curing temperature
  • Provides good adhesion on LCP and Nylon
  • Low RBO (Resin Bleed out ) performance

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ALPHA HiTech AD43-9600W

  • Low curing temperature at 80 °C for 2 minutes (reflow)
  • Excellent high temperature adhesion to PMMA and very good on LCP and Nylon


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ALPHA HiTech UV Adhesive is formulated to be cured at ambient temperature under ultraviolet light. These products can be used in various applications such as coating and fixing of components which require high tensile strength and moisture resistance.


ALPHA HiTech UP44-5566T

  • Curing in seconds under UV at room temperature
  • Excellent for high throughput manufacturing
  • Very good adhesion on PC and PMMA

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Edgebond
Dispense and Cure on Edges or Corners of BGAs


ALPHA HiTech Edgebond is a one component, heat curable material for edge or corner bonding applications. Upon deposition, it will not flow beneath the BGA. The cured edgebond will help to strengthen the soldered assembled component so it can pass reliability tests such as Drop Shock, Impact Bend and Thermal Cycle (TCT).


ALPHA HiTech CF31-4010

  • No Flow characteristics
  • Pass 2,700 cycles -40 +125 °C, 30 minutes TCT with SAC305 alloy
  • Pass 3,000 cycles -40 +150 °C, 30 minutes TCT with Innolot alloy

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ALPHA HiTech CF12-4485B

  • 1 to 10°C storage condition
  • 7 days pot life at 25°C
  • Pass 1,500 cycles -40 +125 °C, 30 minutes TCT with SAC305 alloy
     

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Alpha

Underfill
Protect Solder Joints in BGA, CSP or Flip Chip


ALPHA HiTech Underfill is an epoxy based material to be dispensed on the edges of the BGA, CSP or Flip Chip devices. The material then flows beneath the component through capillary action.

Upon completion of the curing process, the cured underfill helps strengthen the soldered assembled component, allowing it to pass reliability tests such as Drop Shock, Impact Bend and Thermal Cycle (TCT).

ALPHA HiTech has developed Underfill to accommodate variations in customer requirements throughout the industry.


ALPHA HiTech CU31-2030

  • Low viscosity, fast flow at room temperature
  • Pass 3,000 cycles -40 +125 °C, 30 minutes TCT with SAC305 alloy

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ALPHA HiTech CU21-3240

  • Fast flowing on 70 - 100 °C substrate temperature
  • Pass 5,000 cycles -40 +125 °C, 30 minutes TCT with SAC305 alloy

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ALPHA HiTech CU13-3150

  • Low viscosity, fast flow at room temperature
  • Low curing temperature at 80 °C for 30 minutes

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ALPHA HiTech CU11-3127

  • High glass transition temperature (Tg)
  • Low coefficient of thermal expansion (CTE)

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