Techni-Tool
Indium Solder
Indium Solder

Indium Solder PASTEOT-800999-500G Solder Paste, No Clean, Lead Free, T4.5, 88.25%, SAC305, 500g Jar

Our Part #IND-800999-500G

Condition:New

Mfr Part #PASTEOT-800999-500G

Indium Solder PASTEOT-800999-500G
Indium Solder
Indium Solder

Indium Solder PASTEOT-800999-500G Solder Paste, No Clean, Lead Free, T4.5, 88.25%, SAC305, 500g Jar

Our Part #IND-800999-500G

Condition:New

Mfr Part #PASTEOT-800999-500G

Next Day Air Only
CA Prop 65
$292.80EACH
Qty:Price:Savings
1$292.80
5$278.16Save 5%
10$269.38Save 8%
20$257.66Save 12%
Multiples of: 3
Next Day Air Only
Calif. Prop 65
  • High transfer efficiency through small apertures (≤0.66AR)
  • Eliminates graping phenomenon on small deposits
  • Low-voiding in BGA/CSP solder joints

Solder Paste

Indium Corporation’s high quality solder pastes are uniquely formulated for superior performance to satisfy a variety of assembly requirements.

Indium Corporation produces a wide range of solder paste products to fit every need and challenge in the PCB Assembly and semiconductor manufacturing market space. Solder paste can be manufactured in hundreds of alloys and with powder size ranging from Type 3 to Type 8. Solder pastes are available for a wide variety of process deposition techniques, including printing, dipping, dispensing, jetting, and pin transfer assembly. Each formula is specifically designed to meet the gamut of manufacturing challenges that plague the electronics manufacturing industry. Whether you are dealing with warpage induced defects, voiding, insufficient solder paste volume, or electrical or mechanical reliability issues, Indium Corporation’s solder pastes allow for the lowest total cost of ownership and fewer end-of-line defects.

Indium8.9E Pb-Free Solder Paste

Indium8.9E is an air reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by the SnAgCu, SnAg, and other alloy systems favored by the electronics industry to replace conventional Pb-bearing solders. Indium8.9E offers unprecedented stencil print transfer efficiency to work in the broadest range of processes. In addition, the high oxidation resistance of Indium8.9E virtually eliminates incomplete coalescence (graping) of small deposits.


BrandIndium Solder
AlloySAC305
Alternate Product NumberIndium8.9E
Series8.9E Series
TypeSolder Paste
Lead FreeYes
Package TypeJar
Lead TypeLead Free
Physical StatePaste
Volume500 g
Powder Mesh SizeT4.5
Halogen ContentHalogen
Metal %88.25 %
Composition96.5% Tin, 3% Silver, 0.5% Copper
Flux CharacteristicsNo-Clean
Package500g Jar
Shelf Life6 months
$292.80EACH
Qty:Price:Savings
1$292.80
5$278.16Save 5%
10$269.38Save 8%
20$257.66Save 12%
Multiples of: 3