- Unique Oxidation Barrier Technology; No more head-in-pillow defects Strong oxidation barrier Low voiding (less than 5%) for many profiles when soldering BGAs with via-in-pad technology
- Robust Reflow Capability
- Indium 8.9HF-1 Only: Provides best-in-class probe-testability with few false rejects from in-circuit testing Extremely thermally stable; maintains soft, pliable residue, even after reflow
Indium8.9HF1 is an air reflow, no-clean solder paste. Indium8.9HF1 offers unprecedented stencil print transfer efficiency to work in the broadest range of processes. In addition, the high probe testability of Indium8.9HF1 minimizes false failures in ICT.