- Excellent wetting and solder joint appearance
- Exceptional printing and response-to-pause
- Wide reflow profile window
- Outstanding slump resistance
Indium Corporation’s high quality solder pastes are uniquely formulated for superior performance to satisfy a variety of assembly requirements.
Indium Corporation produces a wide range of solder paste products to fit every need and challenge in the PCB Assembly and semiconductor manufacturing market space. Solder paste can be manufactured in hundreds of alloys and with powder size ranging from Type 3 to Type 8. Solder pastes are available for a wide variety of process deposition techniques, including printing, dipping, dispensing, jetting, and pin transfer assembly. Each formula is specifically designed to meet the gamut of manufacturing challenges that plague the electronics manufacturing industry. Whether you are dealing with warpage induced defects, voiding, insufficient solder paste volume, or electrical or mechanical reliability issues, Indium Corporation’s solder pastes allow for the lowest total cost of ownership and fewer end-of-line defects.
Pb-Free Water-Soluble Solder Pastes
Over the last decade, the electronics industry has shifted to no-clean fluxes for surface mount assembly. Despite this industry trend, Indium Corporation has not only maintained a variety of water-soluble solder pastes and fluxes, but has revolutionized the category with the release of several new and versatile solder pastes. These solder pastes allow current water-wash manufacturing processes to not only survive, but to thrive.
Indium6.3 Water-Soluble Solder Paste
Indium6.3 exhibits excellent wetting on a wide variety of surface finishes, such as immersion tin, immersion silver, nickel/gold, palladium, alloy 42, HASL, and OSP, under both air and nitrogen reflow atmosphere. The solder joints yielded are very shiny and smooth, including those of ultrafine-pitch components. Indium6.3 has ultra-low voiding performance. Minimal voiding can be achieved with optimal process conditions.