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Quantity on Order:6
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Next Day Air Only
Calif. Prop 65
- Description
- Specifications
- Documents
- Defect Elimination: Solves graping defects by inhibiting oxidation during long reflow and promoting coalescence
- Reduced head-in-pillow defects
- Printing: Offers great print transfer efficiency Designed for CSP, 0201, and 01005 technologies
Indium8.9E is an air reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by the SnAgCu, SnAg, and other alloy systems favored by the electronics industry to replace conventional Pb-bearing solders. Indium8.9E offers unprecedented stencil print transfer efficiency to work in the broadest range of processes. In addition, the high oxidation resistance of Indium8.9E virtually eliminates incomplete coalescence (graping) of small deposits.
Brand:Â Indium Solder
Alloy:Â 8.9E
Alternate Product Number:Â IND-800515-600C
Flux Type:Â ROL1
Series:Â 8.9E Series
Type:Â Solder Paste
Lead Free:Â Yes
Package Type:Â Cartridge
Lead Type:Â Lead Free
Physical State:Â Paste
Volume:Â 600 g
Powder Mesh Size:Â T4
Metal %:Â 88.5 %
Flux Characteristics:Â No-Clean
Package:Â 600g Cartridge
Shelf Life:Â 6 months
$168.36EACH
Quantity on Order:6
Qty: | Price: | Savings |
---|---|---|
1 | $168.36 | |
5 | $152.37 | Save 10% |
10 | $143.95 | Save 14% |
50 | $134.69 | Save 20% |