• Defect Elimination: Solves graping defects by inhibiting oxidation during long reflow and promoting coalescence
• Reduced head-in-pillow defects
• Printing: Offers great print transfer efficiency Designed for CSP, 0201, and 01005 technologies

Indium8.9E is an air reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by the SnAgCu, SnAg, and other alloy systems favored by the electronics industry to replace conventional Pb-bearing solders. Indium8.9E offers unprecedented stencil print transfer efficiency to work in the broadest range of processes. In addition, the high oxidation resistance of Indium8.9E virtually eliminates incomplete coalescence (graping) of small deposits.