
$162.12EACH
Estimated Mfr lead time:19 Days
Qty: | Price: | Savings |
---|---|---|
1 | $162.12 | |
5 | $146.72 | Save 10% |
10 | $138.61 | Save 14% |
50 | $129.70 | Save 20% |
Next Day Air Only
Calif. Prop 65
- Description
- Specifications
- Documents
- Defect Elimination: Solves graping defects by inhibiting oxidation during long reflow and promoting coalescence
- Reduced head-in-pillow defects
- Printing: Offers great print transfer efficiency Designed for CSP, 0201, and 01005 technologies
Indium8.9E is an air reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by the SnAgCu, SnAg, and other alloy systems favored by the electronics industry to replace conventional Pb-bearing solders. Indium8.9E offers unprecedented stencil print transfer efficiency to work in the broadest range of processes. In addition, the high oxidation resistance of Indium8.9E virtually eliminates incomplete coalescence (graping) of small deposits.
Brand:Â Indium Solder
Alloy:Â 8.9E
Alternate Product Number:Â SAC305
Flux Type:Â No Clean
Series:Â 8.9 Series
Type:Â Solder Paste
Lead Free:Â Yes
Package Type:Â Cartridge
Volume:Â 600 g
Powder Mesh Size:Â T4
Metal %:Â 88.5 %
Package:Â 600g Cartridge
$162.12EACH
Estimated Mfr lead time:19 Days
Qty: | Price: | Savings |
---|---|---|
1 | $162.12 | |
5 | $146.72 | Save 10% |
10 | $138.61 | Save 14% |
50 | $129.70 | Save 20% |