• Meets Bellcore specification TR-NWT-000078
• Meets IPC J-STD-004 flux type ORL0
• Eliminates the need for cleaning
• Excellent wetting and solderability
• Compatible with conformal coatings without cleaning
• Will not interfere with pin testing

3590-T is a low-solids, non-halide, rosin/resin-free flux designed to eliminate post-cleaning operations. The effective flux activators provide superior solderability of surface mount, mixed technology, and through-hole electronic assemblies. 3590-T has a wide process window with excellent wetting capabilities, leaving no residue and high surface insulation resistance.
3590-T is best applied by ultrasonic spray, but can also be applied by foam. Controlled applications such as flux deposition and uniformity are integral factors when soldering with no-clean chemistry. A flux deposition rate of 500–1,000 micrograms per square inch of flux solids should be applied as a starting point. The ideal topside board temperature is approximately 100°C (210°F). Preheat temperatures can differ based on wave soldering equipment, board thickness, components, and conveyor speed. 3590-T uses 16-3000 Thinner to maintain specific gravity or acid value. Thinner is not required in an enclosed fluxing system. The acid value should be monitored using a digital titrator when foaming to control flux concentration. To prevent contamination on assemblies in an open fluxing system, periodic replacement of flux is recommended.