- Description
Indium Solder Paste, 10.1, SAC305, No Clean, T4, 88.5%, 600g Cartridge
Air or nitrogen reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by SnAgCu and other Pb-free alloy systems. Exceptional stencil print transfer efficiency to work in the broadest range of processes. High oxidation resistance virtually eliminates incomplete coalescence (graping) of small deposits and head-in-pillow defect. 600g cartridge.
- Low voiding on QFN, BGA, and CSP components
- High transfer efficiency and low variation through small apertures (andle;0.66 AR)
- Outstanding RF shield metallization wetting
Specifications:
Alloy: SAC305
Metal Load: 88.5%
Specifications:
Alloy: SAC305
Powder Size: Type 4
Metal Load: 88.5%