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Kester
Kester

Kester 70-5022-0910 Solder Paste, Water Soluble, LF, T4, 88.8%, Sn96.5Ag3Cu0.5, 500g, WP616 Series

Our Part #701-144

Condition:New

Mfr Part #70-5022-0910

Kester 70-5022-0910
Kester
Kester

Kester 70-5022-0910 Solder Paste, Water Soluble, LF, T4, 88.8%, Sn96.5Ag3Cu0.5, 500g, WP616 Series

Our Part #701-144

Condition:New

Mfr Part #70-5022-0910

Next Day Air Only
CA Prop 65
Has Expiration Date
RoHS
$160.60EACH
Next Day Air Only
Calif. Prop 65
Has Expiration Date
RoHS
  • Superior reflow characteristics
  • Classified as ORM0 per J-STD-004B
  • Excellent activity and printability
  • Zero-Halogen (none intentionally added)
  • Wide reflow profile window with good solderability
  • Reflowable in air and nitrogen conditions
  • Cleaning can be accomplished with heated de-ionized water

WP616 is a zero-halogen, lead-free, water-soluble solder paste formula for both nitrogen and air reflow applications. Offers a combination of consistent print performance at wide humidity levels, excellent solderability and ease of cleaning, while maintaining a zero-halogen flux formulation. WP616 is a stable water-soluble formula, providing consistent stencil life, tack time and print definition. Classified as ORM0 flux under IPC J-STD-004B.
Provides a Consistent Stencil Life, Tack Time and Print Definition

BrandKester
Alloy NameSAC305
Flux TypeWater Soluble
Lead FreeYes
Powder Mesh SizeT4
Metal %88.8 %
Package TypeJar
Halogen ContentHalogen Free
SeriesWP616 Series
Alternate Product Number7050220910
Alloy TypeNear-Eutectic Alloys
Composition96.5% Tin, 3% Silver, 0.5% Copper
Container Type500g Jar
Liquidus Point220 C (428 F)
Melting Point217 C (423 F)
Melting Range217-220 C (423-428 F)
Shelf Life180 days
TypeSolder Paste
Water SolubleYes
$160.60EACH

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