Kester
Kester 70-5022-0910 Solder Paste, Water Soluble, LF, T4, 88.8%, Sn96.5Ag3Cu0.5, 500g, WP616 Series
Our Part #701-144
Condition:New
Mfr Part #70-5022-0910
Kester
Kester 70-5022-0910 Solder Paste, Water Soluble, LF, T4, 88.8%, Sn96.5Ag3Cu0.5, 500g, WP616 Series
Our Part #701-144
Condition:New
Mfr Part #70-5022-0910
Next Day Air Only
CA Prop 65
Has Expiration Date
RoHS
Next Day Air Only
Calif. Prop 65
Has Expiration Date
RoHS
- Description
- Specifications
- Superior reflow characteristics
- Classified as ORM0 per J-STD-004B
- Excellent activity and printability
- Zero-Halogen (none intentionally added)
- Wide reflow profile window with good solderability
- Reflowable in air and nitrogen conditions
- Cleaning can be accomplished with heated de-ionized water
WP616 is a zero-halogen, lead-free, water-soluble solder paste formula for both nitrogen and air reflow applications. Offers a combination of consistent print performance at wide humidity levels, excellent solderability and ease of cleaning, while maintaining a zero-halogen flux formulation. WP616 is a stable water-soluble formula, providing consistent stencil life, tack time and print definition. Classified as ORM0 flux under IPC J-STD-004B.
Provides a Consistent Stencil Life, Tack Time and Print Definition
Brand: Kester
Alloy Name: SAC305
Flux Type: Water Soluble
Lead Free: Yes
Powder Mesh Size: T4
Metal %: 88.8 %
Package Type: Jar
Halogen Content: Halogen Free
Series: WP616 Series
Alternate Product Number: 7050220910
Alloy Type: Near-Eutectic Alloys
Composition: 96.5% Tin, 3% Silver, 0.5% Copper
Container Type: 500g Jar
Liquidus Point: 220 C (428 F)
Melting Point: 217 C (423 F)
Melting Range: 217-220 C (423-428 F)
Shelf Life: 180 days
Type: Solder Paste
Water Soluble: Yes