AIM Solder FF35-30CC Resin Epoxy

Underfill FF35 is a low surface tension, one component epoxy resin designed for use as a capillary flow underfill for flip chip, CSP, BGA and uBGA assemblies. Underfill FF35’s excellent capillary action forms a thin bond line and complete spread. Underfill FF35 enhances reliability with a high Tg, low CTE, and excellent adhesion. Faster throughput and higher yields are achieved through fast flow characteristics and rapid cure speeds. Underfill FF35 may be reworked at 120°C (250°F). Underfill FF35’s viscosity and performance remain stable throughout its shelf life for ease of use.

Features and Benefits