• Ultra-low voiding, including bottom termination (BTC) assemblies
  
• Enhanced Electrical Reliability performance
  
• Outstanding solder beading, very low bridging, slump, solder balling, and head-in-pillow
  
• Exceptional printing—high transfer efficiency and low variation
  
• Halogen-free per IEC 61249-2-21, test method EN14582
  
• Excellent wetting to fresh and aged common metallizations and surface finishes, including, but not limited to: OSP, Immersion Sn, Immersion Ag, ENIG

Indium10.1HF is an air reflow, no-clean, halogen-free, Pb-free solder paste specifically formulated to have ultra-low voiding, especially for designs that incorporate large ground pads otherwise known as bottom termination components (BTCs). BTCs include packages such as QFNs, DPAKs, and MOSFETs. The flux chemistry is specifically engineered to improve reliability by minimizing voiding and maximizing ECM and head-in-pillow performance while also providing excellent wetting, solder beading, solder balling, and slump to meet IPC specifications. It is compatible with lead-free alloys such as SnAgCu, SnAg, and other alloy systems favored by the electronics industry.