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Kester NXG1 Solder Paste No Clean Lead Free Sn96.5Ag3Cu.5 (SAC305) 88.5 % T3 500 g Jar Halogen NXG1 Series

488SO791 MFG #: NXG1
$96.00 / EA
  • Alloy: Sn96.5Ag3Cu.5 (SAC305)
  • Flux Type: No Clean
  • Halogen Content: Halogen
  • Lead Type: Lead Free
  • Metal %: 88.5 %
  • Package Type: Jar
  • Powder Mesh Size: T3
  • Series: NXG1 Series
  • Volume: 500 g
  • Application: Screen/Stencil Printing
  • Clearance: No
  • Drill Down Description: Solder Paste, No Clean, Lead Free, Sn96.5Ag3Cu.5 (SAC305), 88.5 %, T3, 500 g Jar, Halogen, NXG1 Series
  • Lead Free: Yes
  • Model: NXG1
  • Package: 500g Jar
  • Primary Keyword: Solder Paste
  • S3 Page Number Text: 277, 281, 453, 487

QTY
  • Description
  • 8 month shelf life
  • Offers excellent cosmetic appearance
  • Long stencil & tack life
  • Type ROL1, IPC ANSI/J-STD-004A

Capable of stencil printing downtimes up to 120 minutes with an effective first print down to 20 mils without any kneading.

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