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Kester Solder Paste No Clean Lead Free Sn96.5Ag3.0Cu0.5 88.5 % T3 500 g Jar Halogen EM907 Series

488SO3309
$96.00 /
  • Alloy: Sn96.5Ag3.0Cu0.5
  • Flux Type: No Clean
  • Halogen Content: Halogen
  • Lead Type: Lead Free
  • Metal %: 88.5 %
  • Package Type: Jar
  • Powder Mesh Size: T3
  • Series: EM907 Series
  • Volume: 500 g
  • Application: Screen/Stencil Printing
  • Drill Down Description: Solder Paste, No Clean, Lead Free, Sn96.5Ag3.0Cu0.5, 88.5 %, T3, 500 g Jar, Halogen, EM907 Series
  • Initial Tackiness UOM: g
  • Package: 500g Jar
  • Primary Keyword: Solder Paste
  • S3 Page Number Text: 277, 281, 453, 487

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