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Kester 7048230910 Solder Paste No Clean Lead Free Sn96.5Ag3.0Cu0.5 88.3 % T4 500g Jar NP560 Series

488SO0910 MFG #: 7048230910
$97.00 /
  • Alloy: Sn96.5Ag3.0Cu0.5
  • Flux Type: No Clean
  • Halogen Content: Zero Halogen
  • Lead Type: Lead Free
  • Metal %: 88.3 %
  • Package Type: Jar
  • Powder Mesh Size: T4
  • Series: NP560 Series
  • Volume: 600 g
  • Application: Screen/Stencil Printing
  • Drill Down Description: Solder Paste, No Clean, Lead Free, Sn96.5Ag3.0Cu0.5, 88.3 %, T4, 500g Jar, NP560 Series
  • Features: NP560 is a no-clean, lead-free, halogen-free solder paste. It consistently delivers paste transfer efficiencies of 0.50 to 0.55 AR and is fully capable of printing and reflowing 01005 components, even
  • Model: 7048230910
  • Package: 500g Jar
  • Primary Keyword: Solder Paste
  • Shelf Life: The shelf life for NP560 T3 and T4 is 12 months from the date of manufacture when stored in refrigeration and can be stored up to 4 weeks at room temperature (up to 27 Deg. C/80 Deg. F) with minimal i

Extremely Stable and Has an Unrefrigerated Shelf Life of 6 Months

QTY
  • Description
  • Classified as ROL0 per J-STD-004B
  • Halogen-Free
  • Low voiding potential under QFNs
  • Excellent activity and printability
  • Very low graping
  • Reflowable in air and nitrogen conditions
  • Wide reflow profile window with good solderability on various PCB surface finish

NP560 is a no-clean, lead-free, halogen-free solder paste. It consistently delivers paste transfer efficiencies of 0.50 to 0.55 AR and is fully capable of printing and reflowing 01005 components, even in air, with minimal graping behavior. In addition to its stable, consistent product performance, NP560 has redefined the voiding standard for PCB assembly and has the potential for low voiding performance. NP560 is classified as ROL0.

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