Kester
Kester 70-4823-0910 Solder Paste, No Clean, LF, T4, 88.3%, Sn96.5Ag3Cu0.5, 500g Jar, NP560 Series
Our Part #488SO0910
Condition:New
Mfr Part #70-4823-0910
Kester
Kester 70-4823-0910 Solder Paste, No Clean, LF, T4, 88.3%, Sn96.5Ag3Cu0.5, 500g Jar, NP560 Series
Our Part #488SO0910
Condition:New
Mfr Part #70-4823-0910
Next Day Air Only
Has Expiration Date
RoHS
$170.33EACH
Quantity on Order:10
Estimated Mfr lead time:18 Days
| Qty: | Price: | Savings |
|---|---|---|
| 1 | $170.33 | |
| 10 | $156.70 | Save |
| 25 | $149.89 | Save |
| 50 | $144.78 | Save |
Next Day Air Only
Has Expiration Date
RoHS
- Description
- Specifications
- Documents
- Classified as ROL0 per J-STD-004B
- Halogen-Free
- Low voiding potential under QFNs
- Excellent activity and printability
- Very low graping
- Reflowable in air and nitrogen conditions
- Wide reflow profile window with good solderability on various PCB surface finish
NP560 is a no-clean, lead-free, halogen-free solder paste. It consistently delivers paste transfer efficiencies of 0.50 to 0.55 AR and is fully capable of printing and reflowing 01005 components, even in air, with minimal graping behavior. In addition to its stable, consistent product performance, NP560 has redefined the voiding standard for PCB assembly and has the potential for low voiding performance. NP560 is classified as ROL0.
Extremely Stable and Has an Unrefrigerated Shelf Life of 4 Weeks
Brand: Kester
Alloy Name: SAC305
Flux Type: No Clean
Lead Free: Yes
Powder Mesh Size: T4
Metal %: 88.3 %
Package Type: Jar
Halogen Content: Halogen Free
Series: NP560 Series
Alternate Product Number: SAC305, 7048230910
Alloy Type: Near-Eutectic Alloys
Composition: 96.5% Tin, 3% Silver, 0.5% Copper
Container Type: 500g Jar
Liquidus Point: 220 C (428 F)
Melting Point: 217 C (423 F)
Melting Range: 217-220 C (423-428 F)
Shelf Life: The shelf life for NP560 T3 and T4 is 12 months from the date of manufacture when stored in refrigeration and can be stored up to 4 weeks at room temperature (up to 27 Deg. C/80 Deg. F) with minimal impact to overall product performance. NP560 T5 has a re
Special Features: NP560 is a no-clean, lead-free, halogen-free solder paste. It consistently delivers paste transfer efficiencies of 0.50 to 0.55 AR and is fully capable of printing and reflowing 01005 components, even in air, with minimal graping behavior. In addition to
Type: Solder Paste
$170.33EACH
Quantity on Order:10
Estimated Mfr lead time:18 Days
| Qty: | Price: | Savings |
|---|---|---|
| 1 | $170.33 | |
| 10 | $156.70 | Save |
| 25 | $149.89 | Save |
| 50 | $144.78 | Save |