$154.93EACH
Quantity on Order:10
Qty: | Price: | Savings |
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1 | $154.93 | |
10 | $142.54 | Save 8% |
25 | $136.34 | Save 12% |
50 | $131.69 | Save 15% |
Next Day Air Only
- Description
- Specifications
- Documents
- Classified as ROL0 per J-STD-004B
- Halogen-Free
- Low voiding potential under QFNs
- Excellent activity and printability
- Very low graping
- Reflowable in air and nitrogen conditions
- Wide reflow profile window with good solderability on various PCB surface finish
NP560 is a no-clean, lead-free, halogen-free solder paste. It consistently delivers paste transfer efficiencies of 0.50 to 0.55 AR and is fully capable of printing and reflowing 01005 components, even in air, with minimal graping behavior. In addition to its stable, consistent product performance, NP560 has redefined the voiding standard for PCB assembly and has the potential for low voiding performance. NP560 is classified as ROL0.
Extremely Stable and Has an Unrefrigerated Shelf Life of 4 Weeks
Brand:Â Kester
Alloy:Â Sn96.5Ag3Cu0.5
Flux Type:Â No Clean
Lead Type:Â Lead Free
Powder Mesh Size:Â T4
Metal %:Â 88.3 %
Package Type:Â Jar
Volume:Â 600 g
Halogen Content:Â Halogen Free
Series:Â NP560 Series
Alternate Product Number:Â SAC305
Composition:Â 96.5% Tin, 3% Silver, 0.5% Copper
Features:Â NP560 is a no-clean, lead-free, halogen-free solder paste. It consistently delivers paste transfer efficiencies of 0.50 to 0.55 AR and is fully capable of printing and reflowing 01005 components, even in air, with minimal graping behavior. In addition to
Lead Free:Â Yes
Package:Â 500g Jar
Shelf Life:Â The shelf life for NP560 T3 and T4 is 12 months from the date of manufacture when stored in refrigeration and can be stored up to 4 weeks at room temperature (up to 27 Deg. C/80 Deg. F) with minimal impact to overall product performance. NP560 T5 has a re
Type:Â Solder Paste
$154.93EACH
Quantity on Order:10
Qty: | Price: | Savings |
---|---|---|
1 | $154.93 | |
10 | $142.54 | Save 8% |
25 | $136.34 | Save 12% |
50 | $131.69 | Save 15% |