• Excellent 1.36 W/(m•K) thermal conductivity
• Easy 1:1 mix ratio
• Adheres to most electronic substrates Stores and ships at slightly below room temperature
• Strong water and chemical resistance to brine, acids, bases, and aliphatic hydrocarbons

The 8329TCM medium cure thermal conductive adhesive is an electronically insulating epoxy that combines moderate curing rate and high thermal conductivity. It has a convenient 1-to-1 ratio, a workable 45 minutes pot life, and a moderate curing rate. It may achieve a minimal service cure in seven hours at room temperature. The cured adhesive bonds very well to most substrates used in electronic assemblies; and resists thermal and mechanical shocks.
Good When a Moderate Working Time and Rapid Curing is Required at Elevated Temperature