Skip to Content
You have new quote information. View My Dashboard ×
This is main content
Kester

Kester 7041050910 Solder Paste No Clean Lead Free Sn96.5Ag3Cu.5 (SAC305) 88.3 % T4 500 g Jar NP545 Series

483-839 MFG #: 7041050910
$99.00 / EA
7
  • Alloy: Sn96.5Ag3Cu.5 (SAC305)
  • Flux Type: No Clean
  • Lead Type: Lead Free
  • Powder Mesh Size: T4
  • Metal %: 88.3 %
  • Package Type: Jar
  • Volume: 500 g
  • Halogen Content: Zero Halogen
  • Series: NP545 Series
  • Application: Screen/Stencil Printing
  • Drill Down Description: Solder Paste, No Clean, Lead Free, Sn96.5Ag3Cu.5 (SAC305), 88.3 %, T4, 500 g Jar, NP545 Series
  • Features: NP545 is a no-clean formula. The residues do not need to be removed for typical applications. Although NP545 is designed for no-clean applications; its residues can be removed using automated cleaning
  • Model: 7041050910
  • Primary Keyword: Solder Paste
  • S3 Page Number Text: 280
  • Shelf Life: NP545 has a unrefrigerated shelf life, at a max temperature of 26°C (79°F), of 6 months; however if refrigerated, NP545 should be stabilized at room temperature prior to printing. Shelf life is 1 year

Extremely Stable and Has an Unrefrigerated Shelf Life of 6 Months

QTY
  • Description
  • Consistent print performance to 0.5AR
  • Wide reflow profile window with good solderability
  • Shelf life: 6 month unrefrigerated shelf life and 1 year refrigerated shelf life
  • Low QFN/BGA voiding
  • Compatible with multiple conformal coatings
  • Excellent cosmetics and a clear residue

Kester NP545 is a zero-halogen, lead-free no-clean solder paste formula designed for consistency and repeatability. NP545 is extremely stable and has an unrefrigerated shelf life of 6 months with no print or solderability degradation. NP545 consistently delivers paste transfer efficiencies of 0.55 to 0.5AR. The paste is also fully capable of printing and reflowing 01005 components, even in air reflow, with minimal graping behavior. NP545 is classified as type ROL0 per IPC J-STD-004B.

Back to top