• Product Type: Sponge in Tray
• Sponge Material: Cellulose
• Tray Material: ABS plastic
• Tray Dimensions: 4.5” x 3.0” x 0.75” (114mm x 76mm x 19 mm)
• Sponge Dimensions: 4.0” x 2.5” x 0.5” (102mm x 64mm x 13 mm)
• Weight: 0.3 lbs (0.14 kg)
• Heat Resistance: Up to 500°F (260°C)

The Hexacon Sponge in Tray is a durable, heat-resistant cleaning solution designed to remove solder residue from tips efficiently, making it essential for electronics manufacturing, jewelry crafting, and precision soldering applications. Its compact tray design ensures stability during use, while the high-quality sponge offers superior absorption and longevity compared to standard tip cleaners. Made in the USA.