Global Specialties GS-830 Solderless Breadboard with Bus Strip

Features and Specifications

• 830 Tie-Points
• Maximum capacity of 1.5 A at 36 V
• ABS plastic body
• Nickel plated phosphor bronze spring clip contacts
• Allowable wire diameter of 0.4-0.7 mm
• Fits 7 total 16-pin ICs
• Measures 6.5 x 2.125 x 0.33 in
• Peel and stick adhesive

A modular type solderless breadboard, the GS-830 is comprised of the GS-100 bus strip and the GS-630 breadboard. Ideal for prototyping low frequency or DC powered circuits.