• Includes dry film, epoxy-backed replacement circuits that do not use messy liquid epoxy
• Includes epoxy for solder mask or base board repair
• Tools and materials conform to IPC guidelines

This kit includes the tools and materials needed to reliably replace damaged lands, surface mount and BGA pads. The unique Circuit Frames used to replace these conductor patterns are made from rolled, annealed copper electroplated with tin. Each Circuit Frame has a dry film adhesive backing. You simply select the appropriate size pad or land, trim it from the Circuit Frame and bond it to the circuit board surface. Included with the kit are a bonding iron and tips to match the various sizes of the lands and pads. A multifunctional epoxy is included for over coating the lap solder joint formed between the replacement pad and connecting circuitry. This kit that is specifically designed to make the repair process as simple and reliable as possible. All the tools and materials are packaged in a rugged ESD safe carrying case.