Techni-Tool
Information notification:

October Exclusive: 10% Off Solder Wire & Bars – Use Code SOLDER10

CAIG
CAIG

CAIG HSC67-6G Silicon Heat Sink, for Electronic Components and Parts, 6g Jar

Our Part #10338966

Condition:NEW

Mfr Part #HSC67-6G

CAIG HSC67-6G
CAIG
CAIG

CAIG HSC67-6G Silicon Heat Sink, for Electronic Components and Parts, 6g Jar

Our Part #10338966

Condition:NEW

Mfr Part #HSC67-6G

RoHS
$6.95EACH
RoHS

combination promotes high thermal conductivity, low bleed and high-temperature stability. The compounds are designed to maintain a positive heat sink seal to improve heat transfer from the electrical/electronic device to the heat sink or chassis, thereby increasing the overall efficiency of the device. A cooler device allows for more efficient operation and better reliability over the life of the device. Thermally conductive materials act as a thermal “bridge” to remove heat from a heat source (device) to the ambient via a heat transfer media.

Thermally conductive compounds are grease like silicone materials, heavily filled with heat-conductive metal oxides. This combination promotes high thermal conductivity, low bleed and high-temperature stability. The compounds are designed to maintain a positive heat sink seal to improve heat transfer from the electrical/electronic device to the heat sink or chassis, thereby increasing the overall efficiency of the device. A cooler device allows for more efficient operation and better reliability over the life of the device. Thermally conductive materials act as a thermal “bridge” to remove heat from a heat source (device) to the ambient via a heat transfer media.

BrandCAIG
Container Size6 g
$6.95EACH

Copyright © 1996–  TestEquity LLC.
All rights reserved.