Loctite 1243768 Epoxy Underfill

3563™ is a rapid curing, fast flowing, liquid epoxy designed for use as a capillary flow underfill for packaged ICs, such as CSPs and BGAs. Its rheology is designed to allow it to penetrate gaps as small as 25 µm. When fully cured, it minimizes induced stress at solder joint and thus improves thermal cycling performance.

Features:

• Color: White
• Odor: Odorless
• Specific Gravity: 1.5225
• Flash Point: > 199.4°F
• VOC Content: 0.55 %