Loctite 1744309 Epoxy Adhesive

ABLESTIK CDF 200 highly filled, conductive die attach adhesive is designed to provide high thermal and electrical conductivity in the attachment of integrated circuits and components onto metallic leadframes. It can be used in a variety of die sizes ranging from 0.2mm x 0.2mm to 5mm x 5mm . This adhesive exhibits strong adhesion to various wafer metallizations and leadframe finishes.

Features:

• Color: Gray
• Odor: Slight
• Specific Gravity: 4.54
• Flash Point: > 212°F
• VOC Content: < 1%