Loctite 2140975 Epoxy Adhesive

ECCOBOND EN 3915T encapsulant is specially designed for flip chip device applications. This material is formulated to be thixotropic thus reducing liquid migration after it is applied to the substrate.

Features:

• Color: Black
• Odor: Mild
• Specific Gravity: 1.66
• Flash Point: > 199.4°F