
Requires Dry Ice
Calif. Prop 65
RoHS
- Description
- Specifications
- Documents
Loctite 945398 Epoxy Encapsulant
ECCOBOND FP4545FC epoxy encapsulant designed as underfill and helps dissipate stress on solder joints and extends thermal cycling performance. This material is specially suited for flip-chip devices requiring improve crack/fracture resistance and noclean flux compatibility.
Features:
- Color: Black
- Odor: Odorless
- Specific Gravity: 1.6
- Flash Point: >212°F
- VOC Content: 0.02%
Brand: Loctite
Viscosity: 6500 cP
Work Life: 8 hrs.
Shelf Life: 270 days
