
Requires Dry Ice
Calif. Prop 65
Has Expiration Date
- Description
- Specifications
- Documents
- Electrically conductive
- Low bleed
- Low outgassing
- 5.5pH
- Heat cure
Die-attach electrically conductive adhesive specially designed for microelectronic chip bonding applications. Ideal for application by an automatic dispenser or hand probe.
When you’re working with microelectronic chip bonding applications, you need a special kind of electrically conductive adhesive. LOCTITE ABLESTIK 84-1LMI die attach adhesive is low bleed, low outgassing, and offers all-round superior performance to traditional soldering.
Brand:Â Loctite
Container Size:Â 1 cc
Container Type:Â Syringe
Applications:Â Die attach
Cure Type:Â Heat Cure
Physical Form:Â Paste
Product Type:Â Adhesive