• Ultra-low flux spattering (ideal for applications with Au finger connectors)
• Ultra-low solder beading
• Halogen-free
• Superior stencil life
• Outstanding print characteristics
• Extremely wide process window

Solder Paste

Indium Corporation’s high quality solder pastes are uniquely formulated for superior performance to satisfy a variety of assembly requirements.

Indium Corporation produces a wide range of solder paste products to fit every need and challenge in the PCB Assembly and semiconductor manufacturing market space. Solder paste can be manufactured in hundreds of alloys and with powder size ranging from Type 3 to Type 8. Solder pastes are available for a wide variety of process deposition techniques, including printing, dipping, dispensing, jetting, and pin transfer assembly. Each formula is specifically designed to meet the gamut of manufacturing challenges that plague the electronics manufacturing industry. Whether you are dealing with warpage induced defects, voiding, insufficient solder paste volume, or electrical or mechanical reliability issues, Indium Corporation’s solder pastes allow for the lowest total cost of ownership and fewer end-of-line defects.

Indium5.8LS Pb-Free Solder Paste

Indium5.8LS is a halide-free, no-clean solder paste specifically formulated for low flux spatter. This material is designed to accommodate the higher processing temperatures required by the SnAgCu, SnAg, and other Pb-free alloy systems in an air or nitrogen reflow atmosphere. This product formulation offers consistent, repeatable printing performance combined with long stencil and tack times to handle the rigors of today’s high speed as well as high mix surface mount lines.